Capacity for state-of-the-art a method of construction matching function realization of high-accuracy product detect capacity materialization of high speed
Know- How of automatic skill (during 14 years)


XSCAN-3080 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach.
Experience a life of efficiency make product by equipment suitable for advance a method of construction.



Major Features :


  • PCB / BGA inspection

- Focus Size : 33μm, 80kv
- Max PCB Size : 350 x 300mm

  • Geometric magnification

- Geometric Enlargement ratio : 20x
- Enlargement on monitor : 300x

  • Automatic position teaching and replying


  • Mediocrity

- Easy inspection by manal manipulator

  • Pseudo 3D image display


  • Simple maintenance

- Sealed type's x-ray tube

  • High Resolution (option)

- Noise clearing capacity
- Pseudo Coloring, 3D Image

  • Easy to use

- Easy to use by mouse

  • Inspection for BGA, PCB, MLB

- Easy input and inspect BGA input Bed
- void, short, excessive solder, insufficient solder inspect capacity

  • User-friendly and easy to use


 X-ray Tube
 Focus Size  33μm
 Tube Current/Voltage/Power
 Max. 250μA/ 80kV/ 15W
 Geometric Enlargement Ratio   3x to 20x
 Enlargement Ratio on the Monitor
 10x to 3000x
 Aging (Preheating)
X-ray shield box and others
 Dimension and Weight
 540mm x 550mm x 1000mm (WxDxH), 150kg
 Externally leaking dose
 1uSv/h or less
 Power Supply
 220VAC±10% 50/60Hz

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